Electronics
Debron Industrial Electronics offers a "Best in Class" printed circuit
manufacturing facility providing a vast array of value added services
from assembly of small, simple thru-hole to extremely complex
16" x 18" mixed technology printed circuit assemblies. With circuit
board layout and design for manufacturability capability and modern
assembly processes, we provide our customers with a total
manufacturing solution for their printed circuit assembly needs.
Debron is proud to announce its Lead-Free Surface Mount Process has
been independently validated and certified by Alpha Metal's CE Analytics.
This Lead-Free Process Validation assures our customers Debron has
processes and capabilitiesin place to meet their Lead-Free and RoHS needs
as they continue to move into the Lead-Free Electronics Era.
The capabilities at Debron cover a wide range of axial, radial,
odd form components, surface mount devices and leading edge
technology Ball Grid Array (BGA) placements. We routinely process
Class I, II, and III single and double-sided configurations with standard
or fine pitch requirements on various printed circuit board substrates
(i.e., FR-4 rigid and flex, polyamide flex...). We routinely handle processing
requests from Single and Double-sized Reflow, Conductive Adhesives,
Intrusive Soldering (Pin in Paste), just to name a few.
Electronic assembly is based on an environmental friendly process utilizing
VOC free no clean fluxes for both reflow and wave solder operations.
Surface Mount Placement Capability
Component size from 0402's through a maximum package size of 2" x 2"
Fine pitch placement to 12 mil and BGA's, up to 1738 ball with 100%
solder paste and BGA vision inspection
Micro BGA's down to .4mm pitch, as well as extensive experience in processing
new Micro Leadframe (MLP), Power Quat Flat No-Lead (PQFN), and Land Grid Array (LGA) Packages
Surface Mount Process Support Equipment
In-line stencil printers, w/2D post-print vision inspection
Vitronics Soltec 10 Zone reflow ovens
CyberOptics KS-75 In-Line Color Automated Optical Inspection (AOI) Machine
Machine Programming Software (CAM) for conversion of customer supplied design data
In-Line CCD camera inspection stations
Vision assisted BGA & Fine Pitch Workstations
X-Ray inspection available
Thru-hole Assembly
High Speed Axial Insertion & Semi-Automatic Odd Form Thru-hole Assembly Equipment
Large format Wave Solder (convection heat & dual-wave)
